There's a new bottleneck in AI chipmaking that almost all happens in Asia right now: advanced packaging. It connects smaller ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom ...

Advanced packaging has quietly become the make-or-break factor in the AI race. Hyperscalers need to combine chiplets, ...

Intel (INTC) has been in ongoing discussions with at least two large customers, including Amazon (AMZN) and Google (GOOG) ...

Intel’s EMIB packaging gains AI customer interest as demand rises and TSMC CoWoS supply constraints push companies toward alternatives.

Fresh off reports Intel (NASDAQ:INTC) is in advanced talks with Google and Amazon (NASDAQ:AMZN | AMZN Price Prediction) for ...

TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is ...