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Odisha gets 3D chip packaging unit
Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of ...
The policy is expected to focus on attracting less capital intensive parts of the semiconductor ecosystem and not on ...
Micraft System Plus (MSP+), a supplier of mass transfer and laser technology equipment, will officially open its new Yangmei ...
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Majhi, Vaishnaw unveil India's first advanced 3D chip packaging unit in Bhubaneswar
The total investment in the project is Rs 1,943.53 crore, including approved Central fiscal support of Rs 799 crore and ...
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift ...
Odisha Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw will inaugurate India's first advanced glass ...
The companies that treat UVC as a flexible, application specific toolkit — rather than a single technology solution — will be ...
Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.
The global corrugated open-head drums market is entering a sustained growth trajectory, driven by the rapid shift toward ...
Automation and High-Quality Print Demand Fueling Growth. global corrugated box printer slotter machine market is projected to grow from USD 1.40 billion in 2025 t ...
“Our study marks a major step toward bringing the speed and efficiency of photonics into environments where conventional semiconductor chips powered by electric current and photonics chips packaged ...
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